Light coupling and distribution for Si3N4/SiO2 integrated multichannel single-mode sensing system
A SPIE journal article published on 2009-01-01 presenting research on light coupling and distribution in integrated Si3N4/SiO2 multichannel single‑mode sensing systems. The source record includes the publisher and content type but no event location or impact details.
Illustrative image: The photoshoot is demonstrating a chip of an electro-optical integrated modulator in the process of wire bonding of electrical contacts. Electro-optical modulation devices are multilayer structures of nanometer-thick materials. They are used as interconnects for data centers for the Internet, in optical transmitters, LiDAR systems, quantum and neuromorphic photonic computing. The presented modulator can achieve speeds up to tens of GHz and low losses of the signal. Designed, simulated and fabric — FMNLab/Wikimedia Commons, CC BY 4.0