Planet Briefing

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Novel alignment technique for 0.1-micron lithography using the wafer rear surface and canceling tilt effect

A SPIE journal article (published 1993-10-01) presents a new alignment method for 0.1-micron lithography that uses the wafer rear surface to cancel tilt effects. The source metadata lists SPIE as publisher and identifies the item as a journal article.

Categories: technology, science-and-space

Generated scores

Scores are based on the cited reporting and use a 1–10 scale. Read the methodology.

Confidence
5/10
Geographic reach
1/10
Global importance
2/10
Impact magnitude
2/10
Positivity
6/10
Urgency
1/10

Why it matters

The technique addresses alignment at the 0.1-micron scale, relevant to precision lithography development.

Sources

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