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Novel alignment technique for 0.1-micron lithography using the wafer rear surface and canceling tilt effect
A SPIE journal article (published 1993-10-01) presents a new alignment method for 0.1-micron lithography that uses the wafer rear surface to cancel tilt effects. The source metadata lists SPIE as publisher and identifies the item as a journal article.
Categories: technology, science-and-space
Generated scores
Scores are based on the cited reporting and use a 1–10 scale. Read the methodology.
- Confidence
- 5/10
- Geographic reach
- 1/10
- Global importance
- 2/10
- Impact magnitude
- 2/10
- Positivity
- 6/10
- Urgency
- 1/10
Why it matters
The technique addresses alignment at the 0.1-micron scale, relevant to precision lithography development.

