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Simultaneous analysis of edge quality parameters for submillimeter-thick silicon wafer bar with Fourier optics

Journal article (Publisher: SPIE-Intl Soc Optical Eng) presenting simultaneous analysis of edge quality parameters for submillimeter-thick silicon wafer bars using Fourier optics. Published 2011-02-01.

Categories: science-and-space, technology

Generated scores

Scores are based on the cited reporting and use a 1–10 scale. Read the methodology.

Confidence
6/10
Geographic reach
1/10
Global importance
2/10
Impact magnitude
2/10
Positivity
6/10
Urgency
1/10

Why it matters

Describes a technical method for analyzing silicon wafer edge quality using Fourier optics relevant to semiconductor inspection research.

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